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IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-4, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 5.45mm TO-3PB-3, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Single phase bridge rectifier case 15.2x15.2mm, pitch 10.9mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/kbpc600.pdf Single phase bridge rectifier case 15.2x15.2mm, pitch 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 2.54mm TO-220F-3, Vertical, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220-7 Vertical RM 1.7mm PentawattF- MultiwattF-5 staggered type-2 TO-220-7 Horizontal RM 0.97mm Multiwatt-9 staggered type-2 TO-220-4 Horizontal RM 2.54mm TO-220-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220-4, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-9, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Horizontal RM 2.54mm staggered type-1 TO-220-9, Horizontal, RM 1.27mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.7mm MultiwattF-11 staggered type-2 TO-220-5, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST Copal_CHS-06A, Slide, row spacing 5.08mm, pin-spacing 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 2.54mm TO-220-4, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 0.9mm staggered type-2 TO-220F-15 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-5, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-7, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 5.45mm TO-46-2, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20.

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