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BackSat Aug 7 10:22:31 2021 e6b834b08c Fix floating pin for op amp 54f1a61ba5 gets jiggy with PCB locator, 13 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1106, With thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 4.5, Wuerth electronics 9776020960 (https://katalog.we-online.com/em/datasheet/9776020960.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 9x-dip-switch SPST KingTek_DSHP09TS, Slide, row spacing 6.73 mm (264 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 5x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 10x-dip-switch SPST CTS_Series194-10MSTN, Piano, row spacing 15.24 mm (600 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-4 Vertical RM 1.7mm staggered type-2 TO-220-4 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 1.27mm, staggered type-2 TO-220-9 Vertical RM 4.58mm IPAK TO-251-3, Horizontal, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 2.54mm staggered type-1 TO-220-9 Vertical 2.54mm Pitch Multiwatt 8 TO-220-9.
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