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(1050 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile JPin SMD DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 10x-dip-switch SPST Copal_CHS-10B, Slide, row spacing 5.9 mm (232 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm x 7.4mm, right angle, https://omronfs.omron.com/en_US/ecb/products/pdf/en-b3f.pdf tactile switch.

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