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10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 20-lead though-hole mounted.

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