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BackIpc_noLead_generator.py DE Package; 14-Lead Plastic Dual Flat, No Lead Package (UC) - 3x3x0.5 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 14 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (JEDEC.
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