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Https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf Maxim Integrated TSOC-6 D6+1,https://datasheets.maximintegrated.com/en/ds/DS2401.pdf, https://pdfserv.maximintegrated.com/land_patterns/90-0321.PDF ATPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/ DPAK TO-252 DPAK-5 TO-252-5 TO-263 / D2PAK / DDPAK SMD package, http://www.icbank.com/icbank_data/semi_package/to268aa_dim.pdf D3PAK TO-268 D3PAK-3 TO-268-3 SMD package Diotec Diotec MicroDil, body 3.0x3.0x1.8mm (e.g. Diode bridge), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/mys40.pdf Diotec MicroDil diode bridge package, diameter 8.9mm, pin pitch 28.90mm diameter 32.5mm Bourns 2300 L_Toroid, Horizontal series, Radial, pin pitch=15.00mm, , length*width=16.5*8.9mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 7.00mm diameter 12.5mm width 5.0mm Capacitor C, Rect series, Radial, pin pitch=3.50mm, diameter=8mm, height=11.5mm, Non-Polar Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=20mm, , length*diameter=12*7.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B300/STYROFLEX.pdf C Axial series Axial Horizontal pin pitch 12.07mm diameter 16.8mm Vishay IHB-1 Inductor, Radial series, Radial, pin pitch=3.50mm, , diameter=10mm, Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=20.32mm, 1.5W, length*diameter=14.3*5.7mm^2 Resistor Axial_DIN0614 series Axial Horizontal pin pitch 5.00mm diameter 12.5mm height 12.5mm Resistor, Axial_Power series, Box, pin pitch=27.94mm, 5W, length*width*height=25*6.4*6.4mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf.

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