3
1
Back

Package (8MA2) - 2x3x0.6 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through.

New Pull Request