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Thermal Pad 3.1x3.1mm; (see Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.ti.com/lit/ds/symlink/ina333.pdf#page=30), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.25 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf.

9.4mm 15-pin D-Sub connector, horizontal/angled (90 deg.
UMS, see http://cdn-reichelt.de/documents/datenblatt/C300/UMS05_1A80_75L_DB.pdf Resistor SMD 0805 (2012 Metric.
Vertex 2.60962 1.70385 19.9.

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