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Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2071, 7 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1 mm² wires, reinforced insulation, conductor diameter 2.4mm, see , script-generated with , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix MKDS-1,5-8-5.08, 8 pins, single row Through hole straight pin header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header SMD 1x36 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x24 2.54mm single row Surface mounted socket strip THT 2x33 2.00mm double row surface-mounted straight socket strip, 2x20, 1.27mm pitch, single row Surface mounted socket strip SMD 1x06 2.54mm single row Surface mounted socket strip SMD 1x22 1.00mm single row style2 pin1 right Through hole straight socket strip.

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