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Plastic DFN (4mm x 4mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic Micro Small Outline http://www.vishay.com/docs/49633/sg2098.pdf SOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_23.pdf, CP-16-23), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP24: plastic shrink small outline package; 28 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 18 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 48 Pin (http://www.ti.com/lit/ds/symlink/cc1312r.pdf#page=48), generated with kicad-footprint-generator JST ZE series connector, S6B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST SUR series connector, B12B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-139-02-xxx-DV-BE-LC, 39 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector JST PH series connector, B11B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0013 example for new part number: 22-27-2161, 16 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.75 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole straight pin header, 2x32, 2.00mm pitch, single row style2 pin1 right Through hole angled pin header, 2x27, 1.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header THT 2x30 2.54mm double row Through hole socket strip SMD 2x40 2.00mm double row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x14 2.00mm single row style1 pin1 left Surface mounted socket strip THT 2x33 1.27mm double row surface-mounted straight socket strip, 2x13, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header THT 2x14 1.27mm double row Through hole straight pin header, 1x10, 1.27mm pitch, single row Through hole angled pin header, 1x25, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header THT 1x24 2.54mm single row Through hole angled pin header THT 2x21 2.54mm double row surface-mounted straight socket strip, 1x24, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x19 2.00mm single row Through hole pin header.

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