Labels Milestones
BackPitch, YFF0006, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x02 2.54mm single row Surface mounted socket strip SMD 1x38 2.54mm single row Through hole straight socket strip, 2x18, 2.00mm pitch, double rows Through hole straight pin header, 2x19, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x01, 2.54mm pitch, DIN 41651.
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