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BackCASE 506CE (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and.
- 42-lead surface-mounted (SMD) DIP package, row spacing.
- If they cut to.
- 2x2 raster, 0.73x0.73mm package, pitch 0.4mm.
- MCV_1,5/12-GF-3.5; number of pins: 04.
- | Standard switching diode, DO-35.