Labels Milestones
Back932BH (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/60001477A.pdf (page 1083)), generated with kicad-footprint-generator JST XA series connector, BM03B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S03B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py FE Package; 16-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Shrink Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SO) - Wide, 5.3 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [TQFP] With Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic Small Outline (SM) - 5.28 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf SSOP, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347), generated with kicad-footprint-generator Soldered wire.
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