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24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 10x-dip-switch SPST Copal_CHS-10A, Slide, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL ZIF 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package for Kodenshi SG-105 with PCB locator, 4 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B2P3-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 2.6, Wuerth electronics 9775086960 (https://katalog.we-online.com/em/datasheet/9775086960.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Lead Frame Chip Scale Package - 9x9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 10x-dip-switch SPST , Slide.

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