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Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator JST J2100 series connector, S9B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.127 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV.

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