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200528-0090, 9 Circuits (https://www.molex.com/pdm_docs/sd/2005280090_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (JEDEC MO-153 Var AD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Tantalum Capacitor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0160, 16 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator connector Hirose top entry Molex FFC/FPC connector, FH12-36S-0.5SH, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 18 Pin (JEDEC MO-153 Var FB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-X (7343-43 Metric), IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20035/dcrcwe3.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-36DP-0.5V, 36 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TO-252/DPAK SMD package, http://www.icbank.com/icbank_data/semi_package/to268aa_dim.pdf D3PAK TO-268 D3PAK-3 TO-268-3 SMD package for Kodenshi SG-105F, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105F.pdf package for diode bridges, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89009xx, 9 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator JST SHL series connector, S16B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 1.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3mm.

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