Labels Milestones
Back1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header SMD 2x23 1.00mm double row Through hole angled pin header THT 1x32 1.00mm single row Through hole angled pin header, 1x21, 1.00mm pitch, single row Through hole socket strip SMD 1x34 1.27mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x07 2.00mm double row surface-mounted straight socket strip, 1x14, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x10 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x33 1.00mm single row style1 pin1 left Surface mounted pin header SMD 2x13 1.00mm double row Through hole angled pin header, 2x26, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole straight Samtec HPM power header series 3.81mm post length, 1x19, 5.08mm pitch.
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