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Bugfix/triangle_smoothness Forget (and ignore) fp-info-cache file as it is .gitignore | 16 .../precadsr_aux_Gerbers/precadsr-F_Cu.gbr | 580 .../precadsr_aux_Gerbers/precadsr-F_Mask.gbr | 185 .../precadsr_aux_Gerbers/precadsr-F_Paste.gbr | 4 .../precadsr_panel_al.kicad_pcb | 2707 .../Bigger_Push_Switch_Hole.kicad_mod | 17 .../PCB/precadsr_aux_Gerbers/precadsr-PTH.drl | 99 .../precadsr_aux_Gerbers/precadsr-job.gbrjob | 128 .../precadsr_panel_al.kicad_pcb | 2510 .../Bigger_Push_Switch_Hole_NPTH.kicad_mod | 18 Panels/luther_triangle_vco_quentin_v3.scad | 14 pin DIP socket | | | | R5, R29 | 3 | A1M | **Potentiometer, 9 mm or 16 mm vertical board mount module ACDC-Converter, Murata, 5W, ClassB, https://www.murata.com/products/productdata/8809982558238/KAC-BAC05.pdf switching power supply tht Constant current LED Driver DC/DC Converter, https://g.recomcdn.com/media/Datasheet/pdf/.fYUQjOlW/.t2a80a771bdbb0ef300f7/Datasheet-93/RCD-24.pdf DCDC-Converter, 30W POE, Silvertel, pitch 2.54mm, size 8.08x6.5mm^2, drill diamater 1.2mm, pad diameter 2mm, outer diameter 3.5mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop as test Point, square 3.0mm side length, hole diameter 0.7mm THT pad as test point, pitch 7.62mm, hole diameter 0.7mm, length 6.5mm, width 1.8mm solder Pin_ diameter 1.0mm, hole diameter 0.5mm test point wire loop as test Point, diameter 4.0mm 2 pins Ceramic Resomator/Filter Murata CSTLSxxxG, http://www.murata.com/~/media/webrenewal/support/library/catalog/products/timingdevice/ceralock/p17e.ashx, length*width=8.0x3.0mm^2 package, package length=6.0mm, package width=3.0mm, 3 pins THT ceramic resonator filter filter SMD Resomator/Filter Murata CSTCE, https://www.murata.com/en-eu/products/productdata/8801162264606/SPEC-CSTNE16M0VH3C000R0.pdf SMD SMT SPST EVQPUL EVQPUC SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77.

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