Labels Milestones
BackThrough-hole, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300.
- Package https://www.fairchildsemi.com/package-drawings/MA/MA03B.pdf 6-pin SuperSOT package https://www.fairchildsemi.com/package-drawings/MA/MA03B.pdf 6-pin SuperSOT.
- HLE-148-02-xxx-DV-A, 48 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- Vertex -1.051415e+02 9.695134e+01 9.151071e+00 vertex -1.050340e+02 9.725134e+01 9.208996e+00.