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I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/0_Datasheets/Humidity/Sensirion_Humidity_Sensors_SHTC3_Datasheet.pdf Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf 24-Lead Plastic Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic QFN (3mm x 2mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor 506BU.PDF 8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.ti.com/lit/pdf/qfnd619), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89006xx, 6 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1102, With thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-794073-x, 4 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-2210, 22 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator connector wire 2.5sqmm double-strain-relief Soldered wire connection, for 2 times 2.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-141-02-xxx-DV, 41 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, 505405-0670 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5040, 4 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator connector wire 1sqmm strain-relief Soldered wire connection, for 2 times 2.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST VH series connector, B12B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector JST XA series connector, 78171-0004 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator JST GH series connector, SM02B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Hirose series connector, S08B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, SM11B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 44.

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