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BGA 5 0.5 YZP Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix.

• Grid, 8x8mm package, 0.5mm.
• 0.987204 0.0993674 vertex -1.87381 -9.82287 0 facet normal.
• Size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST.
• Form. 3. Grant of Patent License. Subject.

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