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Ceramic may work, test debouncing. Maybe enlarge footprint if needed. - Resistor footprint could stand to be able to add glide Update 'README.md' From ec67859b1c2779470b99801ce69f8850b83fa3e1 Mon Sep 17 00:00:00 2001 Subject: [PATCH] rm al panel Hardware/Panel/precadsr_panel_al/fp-lib-table | 4 | 47k | Resistor | | | | R4, R6, R7, R30, R31 Switch, dual pole double throw K switch single-pole double-throw spdt ON-ON horizontal MEC 5G single pole normally-open tactile switch SPST right angle, https://omronfs.omron.com/en_US/ecb/products/pdf/en-b3f.pdf tactile switch SPST right angle, http://www.ckswitches.com/media/1428/os.pdf 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 4x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils SMD DIP Switch SPST Slide 7.62mm 300mil 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads.

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