Labels Milestones
BackKintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x37, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x05 2.00mm single row Surface mounted socket strip THT 1x39 1.27mm single row style2 pin1 right Through hole pin header SMD 1x37 2.00mm single row style1 pin1 left Surface mounted pin header SMD 2x16 2.00mm double row Through hole pin header SMD 1x38 1.27mm single row Through hole socket strip THT 2x15 2.00mm double row surface-mounted straight pin header, 2x31, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x40 1.00mm double.
- Connector, FH12-14S-0.5SH, 14 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator.
- 0612 (1632 Metric), square (rectangular) end terminal.
- Http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package.