Labels Milestones
BackTO-126-3, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 2.54mm TO-220-4, Horizontal, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 1.7mm PentawattF- MultiwattF-5 staggered type-2 TO-220-7, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220F-7, Vertical, RM 0.9mm, staggered type-1 TO-220F-4, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 1.7mm staggered type-2 TO-220-7, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 5.08mm TO-220F-3, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package for diode bridges, row spacing 6.73 mm (264 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET.
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- Pin-PCB-offset 9.9mm mounting-holes-distance 33.3mm mounting-hole-offset.