Labels Milestones
Back2x31, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x32, 2.00mm pitch, double.
- Lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf.
- 3.81mm, size 15.1x7.3mm^2, drill diamater.
- Normal 0.0950838 0.0293292 -0.995037 vertex 9.91705 -1.25281.
- Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix.
- Placement fm_in = [h_margin+working_width/8, row_2, 0]; fm_in.