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BackEnhanced Thin Shrink Small Outline (SS)-5.30 mm Body [TSSOP] with exposed pad 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (JEDEC MO-153 Var DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex PicoBlade Connector System, 53047-0810, 8 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.127 mm² wire, basic insulation, conductor diameter 0.48mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7606_7606-6_7606-4.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LQFN.
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