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- 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TSSOP HTSSOP 0.65 thermal pad HTSSOP32: plastic thin shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm, staggered type-2 TO-220-15, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 5.475mm SOT-93 TO-218-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-247-2, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Horizontal RM 5.475mm SOT-93 TO-220-2, Horizontal, RM 2.54mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 10.95mm SOT-93 TO-218-3, Horizontal, RM 2.54mm, staggered type-1 TO-220-5, Vertical, RM 1.7mm, staggered type-1, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf TO-220-5 Horizontal RM 1.27mm Multiwatt-7 staggered type-1 TO-220-9, Horizontal, RM 1.7mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220F-15 Vertical RM 5.08mm TO-220-3, Horizontal, RM 1.27mm, MultiwattF-15, staggered type-1 TO-220F-2, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-4, Vertical, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Horizontal RM 1.7mm MultiwattF-11 staggered type-1 TO-220F-9, Vertical, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 0.97mm Multiwatt-9 staggered type-2 TO-220F-9, Vertical, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Vertical RM 5.45mm TO-247-3, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-2, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 5x-dip-switch SPST KingTek_DSHP05TJ, Slide, row spacing 8.61 mm (338 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing.

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