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ST WLCSP-156, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm 8-Lead Plastic Dual Flat, No Lead Package - 4x4x0.9 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole socket strip THT 1x10 1.00mm single row style2 pin1 right Through hole angled pin header, 2x40, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x04, 2.00mm pitch, 4.2mm pin length, single row Surface mounted pin header THT 2x29 2.54mm double row Through hole angled pin header SMD 1x26 1.00mm single row Through hole.

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