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(Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 32 leads; body width 4.4 mm; Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf#page=68), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AC), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0310, with PCB locator, 9 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0016 example for new mpn: 39-28-902x, 1 Pins per row (https://www.molex.com/pdm_docs/sd/874371443_sd.pdf#page=2 molex pico spox 14 Molex PicoBlade Connector System, 43045-1000 (alternative finishes: 43045-080x), 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.

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