Labels Milestones
Back464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole pin header THT 1x01 2.54mm single row Through hole socket strip THT 2x35 1.00mm double row Through hole IDC header, 2x32, 2.54mm pitch, single row Through hole pin header SMD 2x10 1.27mm double row surface-mounted straight pin header, 2x21, 2.54mm pitch, 6mm pin length, single row Through hole socket strip SMD 1x26 1.00mm single row Through hole socket strip SMD 2x15 1.00mm double row Through hole straight socket strip, 1x30, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x38 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x24 1.27mm single row Surface mounted socket strip THT 1x11 5.08mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x19 2.54mm single row Through hole straight socket strip, 2x12, 2.00mm pitch, double rows Through hole straight socket strip, 2x25, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC box header THT 2x15 1.27mm.
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