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Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP.

• 0.0635208 0.586827 vertex 1.95005 0.326085.
• F.Cu to B.Cu)" "Name": "Bottom.
• 2x03 2.54mm double row Through hole straight socket.
• 26-60-5080, 8 Pins per row.
• -6.94785 2.87789 6.0001 facet.

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