Labels Milestones
BackWLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias.
- -0.76572 0.473008 facet normal -9.468245e-002 9.955075e-001 0.000000e+000 vertex.
- 1x21, 1.27mm pitch, 4.4mm socket length, double rows.
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-5.31736 8.65691 2.19603 facet normal 0.097362 0.0300634.