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WSON 0.5 thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0410, with PCB cutout, light-direction downwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf package for Standex Meder SIL reed relais Standex-Meder SIL-relais, Form 1B, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex-Meder SIL-relais, Form 1A/1B, see https://standexelectronics.com/de/produkte/ms-reed-relais/ Standex Meder DIP reed relay Standex-Meder SIL-relais, Form 1A, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil SMD SMD 5x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), Socket 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils SMD DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, through-hole, row spacing 5.08 mm (200 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST , Slide, row spacing 25.24 mm (993 mils SMD DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead though-hole.

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