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Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 10-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP.

• Connector, B32B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN.
• -0.115024 -0.957368 0.264982 facet normal 0.801132.
• 0.484683 0.874554 facet normal 0.828719.
• 0 (add_net "/Pots, switches, misc/PUSH_2_P.

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