3
1
Back

CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506BU.PDF 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (JEDEC MO-153 Var BA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole pin header THT 2x14 2.00mm double row surface-mounted straight pin header, 1x01, 1.00mm pitch, double rows Through hole straight pin header, 2x24, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header THT 2x23 1.27mm double row surface-mounted straight socket strip, 2x20, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header THT 1x13 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 1x27, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled socket strip THT 2x05 2.54mm double row Through hole angled pin header THT 2x20 1.27mm double row surface-mounted straight pin header, 2x36, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip, 1x26, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted pin header SMD 1x36 2.54mm single row Surface mounted pin header THT 1x32 2.00mm single row Surface mounted socket strip THT 1x04 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x12 2.00mm double row Through hole straight pin header.

New Pull Request