synth_tools

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BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Package (MS) [MSOP], variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 48 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices KS-4 (like EIAJ SC-82 Infineon PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug up (https://www.infineon.com/cms/en/product/packages/PG-HDSOP/PG-HDSOP-10-1/ HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-3/ Infineon PG-TO-220-7, Tab as Pin 8, see e.g. Https://www.infineon.com/dgdl/Infineon-BTS50055-1TMC-DS-v01_00-EN.pdf?fileId=5546d4625a888733015aa9b0007235e9 Nexperia CFP15 (SOT-1289), https://assets.nexperia.com/documents/outline-drawing/SOT1289.pdf On Semiconductor ECH8, https://www.onsemi.com/pub/Collateral/318BF.PDF Low Profile Inductor, Vishay, IHLP series, 10.2mmx10.2mm Inductor, Vishay, IHLP series, 5.1mmx5.1mm Inductor, Vishay, IHLP series, 10.2mmx10.2mm Inductor, Wuerth Elektronik, Wuerth_HCI-1335, 12.8mmx12.8mm Inductor, Wuerth Elektronik, Wuerth_HCI-1050, 10.2mmx10.2mm Inductor, Wuerth Elektronik, Wuerth_MAPI-3012, 3.0mmx3.0mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-4040, 4.0mmx4.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-60xx, 6.0mmx6.0mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-4040, 4.0mmx4.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-40xx, 4.0mmx4.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-10050, 9.8mmx10.0mm, https://ds.yuden.co.jp/TYCOMPAS/or/specSheet?pn=NR10050T1R3N Inductor, Traco, TCK-047, 5.2x5.8mm, https://www.tracopower.com/products/tck047.pdf Choke, SMD, 12x12mm 4.5mm height Choke, SMD, 12x12mm 8mm height Inductor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Hirose series connector, SM06B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.25 mm² wire, basic insulation, conductor diameter 0.5mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PH series connector, B03B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-144-02-xxx-DV-BE-LC, 44 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0408-9-51, 8 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 68 Pin (https://www.st.com/resource/en/datasheet/stm32h725ze.pdf), generated with kicad-footprint-generator JST XA series connector, BM01B-ACHSS-A-GAN-ETF (http://www.jst-mfg.com/product/pdf/eng/eACH.pdf), generated with.

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