3
1
Back

2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant BA), generated with kicad-footprint-generator Hirose DF11 through hole, DF63M-2P-3.96DSA, 2 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Molex Nano-Fit top entry JST PH series connector, B16B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 52 Pin (http://www.holtek.com/documents/10179/116711/HT1632Cv170.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 14 Pin (http://www.st.com/resource/en/datasheet/lsm6ds3.pdf), generated with kicad-footprint-generator.

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