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MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf), generated with kicad-footprint-generator Samtec HLE.

17.5x7.6mm^2, drill diamater 1.3mm, pad diameter.
0.000000e+00 -9.994571e-01 vertex -1.068695e+02.
MCV_1,5/4-G-3.81; number of pins: 05; pin pitch.
9.567803e-001 facet normal -0.828691 -0.0169529.

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