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SPST Copal_CVS-03xB, Slide, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils.

• Electronics 9774030943 (https://katalog.we-online.de/em/datasheet/9774030943.pdf), generated.
• Hcf Inductor, Wuerth Elektronik, Wuerth_MAPI-1610.
• DIL RM5.08 PhotoTransistor, sidelooker package.
• SIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator.

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