Labels Milestones

Back

No Lead Package (MF) - 3x3x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole pin header THT 2x16 1.27mm double row Through hole socket strip SMD 2x35 1.00mm double row surface-mounted straight socket.

• Vertex 8.74802 -3.62355 3.54602 vertex -2.08528 -9.21464.
• -0.164793 0.855078 vertex -7.16112.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects