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Back0, 0, 0.000)", "track_width": 0.25, "via_diameter": 0.8, "via_drill": 0.4, More tweaks after pro review main arrasta/Samba_Reggae_1.html 62 lines Latest commits for file Panels/FireballSpell_Large.webp Images/PXL_20210831_000922493.jpg Normal file Unescape Hardware/Panel/precadsr-panel/precadsr-panel.kicad_pro Normal file Unescape Dual_VCA.diy Normal file Unescape Schematics/SynthMages.pretty/C_Rect_L22.0mm_W6.1mm_P20mm_MKT_BIG_RED_CAP.kicad_mod Normal file View File 3D Printing/Cases/Eurorack Modular Case/20210926_092147.jpg Executable file Unescape Panels/10_step_seq_38hp_v3.scad Normal file Unescape // pots (all p160s): // PWM duty // pots (all p160s): // PWM duty // pots (all p160s): font_for_label = "Futura XBlk BT:style=Extra Black"; $fn=FN; /* [Panel] */ width = 24; // [1:1:84] square_out = [third_col, third_row, 0]; fm_lvl = [h_margin+working_width/8, row_2, 0]; cv_2b_atten = [right_col, row_3, 0]; cv_in_2b = [right_col, row_6, 0]; cv_1b_atten = [right_col, row_1, 0]; fm_pot = [input_column - h_margin/2, bottom_row, 0]; c_tune = [width_mm/2, top_row, 0]; left_rib_x = thickness + 9.5/2 + tolerance*2; // rib + half a jack col_right = width_mm - thickness*2; // draw panel, subtract holes union() { Panels/luther_triangle_10hp_pcb_holder.stl Normal file View File 3D Printing/Pot_Knobs/potentiometre_v3_1.5_merged.stl Normal file View File Panels/title_test_22.stl Normal file Unescape Hardware/PCB/precadsr/ao_symbols.lib Normal file View File 3D Printing/AD&D 1e spell names in Filmoscope Quentin/POLYMORPH.png Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/Arduino_Nano.kicad_mod Normal file Unescape Hardware/Panel/precadsr_panel_al/precadsr_panel_al.pro Normal file Unescape Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CuTop.gtl Normal file Unescape HP = 5.07; // 5.07 for a single 1.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector Molex MicroClasp Wire-to-Board System, 55935-0510, with PCB locator, 8 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST XH series connector, B3B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator connector JST SHL series connector, 502494-0270 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator JST XA series connector, DF52-3S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 32 Pin (https://www.analog.com/media/en/package-pcb-resources/package/3416438741201015623cp_32_4.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 11, Wuerth electronics 9774140360 (https://katalog.we-online.de/em/datasheet/9774140360.pdf), generated with kicad-footprint-generator Resistor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 43915-xx14, With thermal vias in pads, 7 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA.
- 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-15, Vertical.
- Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6.