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SMT ( http://www.farnell.com/datasheets/1505853.pdf BC-2001 CR2032 2032 Battery Holder SMD Tactile Switch, http://www.helloxkb.com/public/images/pdf/TS-1187A-X-X-X.pdf Ultraminiature Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7811245, 12 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/60001477A.pdf (page 1083)), generated with kicad-footprint-generator Fuse SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://datasheet.octopart.com/HVC0603T5004FET-Ohmite-datasheet-26699797.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 2.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 6 pin, 4.0x2.6, 0.65P; Two exposed pads, (https://www.onsemi.com/pub/Collateral/511BZ.PDF DFN 0.65P dual flag WDFN-8 1EP 2.2X2.0 0.5P WDFN, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf (page 44)), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 40 Pin (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5)), generated with kicad-footprint-generator JST XH series connector, 202396-1207 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF63M-3P-3.96DSA, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770866-x, 2 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-174 , 14 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf.

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