Labels Milestones
Back16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils.
- L_Wuerth_WE-TPC-3816 StepUp generated footprint Coilcraft XAL60xx.
- System, 87437-1443, 14 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated.