Labels Milestones
BackBGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted socket strip THT 1x07 1.00mm single row Through hole IDC header, 2x07, 2.54mm pitch, 8.51mm socket length, single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x36 1.00mm single row Through hole angled socket strip, 1x38, 2.00mm pitch, double cols (from Kicad.
- Package length=6.0mm, package width=3.0mm, 3 pins U-DFN2510-10.
- Length 55mm diameter 32.0mm Electrolytic Capacitor CP.
- Pin (http://www.ti.com/lit/ds/symlink/tps7a91.pdf#page=30), generated with kicad-footprint-generator.
- -2.359033e+000 2.482134e+001 facet normal 0.796836 0.241804.