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Strip, HLE-120-02-xxx-DV-BE-A, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py HVSON, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf), generated with kicad-footprint-generator Hirose series connector, SM08B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xx-DV-PE-LC, 36 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-139-02-xxx-DV-BE, 39 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 1 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type205_RT04505UBLC, 45Degree (cable under 45degree), 4 pins, pitch 10mm, size 55x8.1mm^2, drill diamater 1.1mm, pad diameter 3mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wire, reinforced insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, S06B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 10-Lead Plastic DFN (4mm x 3mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flat, No Lead Package (MF) - 6x5 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip.

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