Labels Milestones
BackPad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284.
- MSTBVA_2,5/15-G-5,08; number of pins: 12; pin pitch.
- Typ MS, https://katalog.we-online.com/pbs/datasheet/744774022.pdf Choke Power Inductor WE-PD2.
- d8eca8dc7ee0c083143ca1478ae7c1277063e5c9 Add polygon calculation for wing.
- PLCC-4 3528 CLV1A-FKB LED Cree PLCC-4.
- Pitch=2.54mm, , length*diameter=3.2*2.6mm^2, , http://www.diodes.com/_files/packages/T-1.pdf.