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20-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 20-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 8-lead.

• -5.37835 0 22.0001 vertex 1.11698 5.25446 22.0001.
• MCV_1,5/5-G-3.81; number of pins.
• -6.7913 -0.858226 7.56202 vertex 4.2532 -5.60181.

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