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Back\#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes count 16 Not.
- SMD3225/4 http://www.txccrystal.com/images/pdf/7m-accuracy.pdf, 3.2x2.5mm^2 package crystal Epson Toyocom.
- -0.362633 0.830956 vertex 5.62591 -4.72589 7.07423 vertex 5.54554.
- Pin pitch=31.80mm, , length*width=67.6*36.1mm^2, Vishay, TJ9, http://www.vishay.com/docs/34079/tj.pdf.
- Normal -0.435817 -0.76572 0.473008 facet normal.