3
1
Back

With SOIC-8, 3.9x4.9mm body, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf), generated with kicad-footprint-generator JST PUD series connector, B20B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-6DP-2DSA, 3 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 16 Pin (http://www.ti.com/lit/ds/symlink/ina3221.pdf#page=44), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight pin header, 2x25, 1.27mm pitch, double rows Through hole pin header SMD 2x31 1.00mm double row Through hole angled pin header, 1x17, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x13 2.00mm single row Through hole angled pin header, 2x12, 2.00mm pitch, double rows Surface mounted pin header THT 2x35 1.27mm double row surface-mounted straight pin header, 2x40, 1.00mm pitch, double rows Through hole socket strip SMD 1x20 1.27mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 2x40, 2.00mm pitch, 6.35mm socket length, single row Through hole angled socket strip THT 1x34 2.54mm single row Surface mounted socket strip SMD 1x12 2.54mm single row Through hole pin.

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