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Mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 32-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body.

• F45c980890 Align panel to PSU.
• Size 11.3x7.3mm^2 drill 0.7mm pad 1.4mm.
• // Horizontal pitch size (mm .

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